Seems like apparently Taiwan Semiconductor along with two of it's subsidiaries will be the major manufacturer of the next generation iPhone. From digitimes, "TSMC have landed foundry orders for GSM EDGE power amplifiers, Bluetooth ICs and 3.2-megapixel OmniVision CMOS image sensor (CIS) used in the upcoming iPhone model, indicated the sources. Xintec will handle the packaging and testing service for the CIS whereas VisEra will manufacture on-chip color filters for the CIS."We're not exactly sure how accurate this information is, however, it is worth taking note of..the full article is here and shown to the right are the parts suppliers.
According to this article, the next-generation iPhone is scheduled to be released mid-2009.
